HengeTek

https://www.hengetek.com

高速信號越來越快PCB尺寸要求越來越小，過往所面臨的信號完整性(Signal Integrity; SI) & 電源完整性(Power Integrity; PI) 問題如: 反射(Reflection)振鈴 (Ringing)、過沖(Overshoot)、下沖(Undershoot)、邊沿不單調(Non-monotonic)、串擾(Crosstalk)、SSN噪聲(Simultaneous Switching Noise)現象更加惡化，若不加以抑制並控制風險，將嚴重損害信號質量影響系統性能。

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Category: Consumer Electronics

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Country: Taiwan (TW)

Currency : TWD

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Platform: EasyStore

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